About R&D
Prof. Albert Tzu-Chia Wu
Dean Research and Development Officer, National Central University
Contact Information
- Office: Office of Research and Development, National Central University
- Phone: +886-3-422-7151 ext. 27050
- Email: atwu@ncu.edu.tw
- Executive Secretary: Nien-Huey Shih
Biographical Summary
Dr. Albert Tzu-Chia Wu serves as the Chief Research and Development Officer at National Central University (NCU), where he oversees the university's research strategic planning and institutional innovation. He earned his Ph.D. in Materials Science and Engineering from the University of California, Los Angeles (UCLA).
With over a decade of dedicated service at NCU, Dr. Wu has held numerous pivotal leadership roles, including Associate Dean of the College of Engineering and Chair of the Department of Chemical and Materials Engineering. His extensive administrative experience is complemented by a distinguished academic career, specifically in the field of advanced materials and electronic packaging.
With over a decade of dedicated service at NCU, Dr. Wu has held numerous pivotal leadership roles, including Associate Dean of the College of Engineering and Chair of the Department of Chemical and Materials Engineering. His extensive administrative experience is complemented by a distinguished academic career, specifically in the field of advanced materials and electronic packaging.
Professional Appointments
- Chief Research and Development Officer, National Central University (Feb 2026 – Present)
- Professor, Dept. of Chemical and Materials Engineering, NCU (Aug 2012 – Present)
- Associate Dean, College of Engineering, NCU (Aug 2023 – Jan 2025)
- Chair, Dept. of Chemical and Materials Engineering, NCU (Aug 2020 – Jul 2023)
- Deputy Vice President, Office of International Affairs, NCU (Aug 2013 – Sep 2017)
- Director, Career Development Center, Office of Student Affairs, NCU (Nov 2011 – Jul 2013)
Research Interests & Expertise
Dr. Wu’s research focuses on the fundamental mechanisms and practical applications of advanced materials in electronics. His areas of specialization include:
- Advanced Electronic Packaging Technology: Investigating next-generation interconnects and packaging solutions.
- Electromigration Phenomena: Analyzing atomic transport in thin-film and bulk materials under high current densities.
- Thermoelectric Module Development: Designing high-efficiency materials for energy conversion and thermal management.
- Device Reliability Analysis: Ensuring the long-term stability and performance of microelectronic components.
